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CPU Module with NXP i.MX53x (Cortex-A8)

CPU Module with NXP i.MX53x (Cortex-A8)
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DIMM-MX53

The SODIMM-modules DIMM-MX535 and DIMM-MX537 can be scaled flexibly due to the use of different processor versions.

Thanks to their high computing power, accelerated 2D/3D graphics and emtrion's guarantee of long-term availability, these modules are intended for industrial applications and particularly suitable for operating tasks and various HMI applications.

In addition, our software specialists provide you with proven embedded operating systems. Ready-to-use BSPs are already available for the DIMM-MX53 family, as well as the following operating systems: Linux, Windows Embedded 7 and 2013, QNX and Android.

To quickly start your application development, simply choose the most suitable Starterkit from our varied assortment.


Features DownloadsSoftwareDeveloper KitsAccessories

Technical Features

Memory
DDR3-SDRAM1024 - 1024 MB
NAND-Flash1024 - 1024 MB
Multimedia
Camera Interface 11 x
Camera Interface 21 x
LCD Interface (LVDS)1 x
LCD Interface (RGB)1 x
SSI Interface for Audio Codec1 x
Connectivity
CAN LVTTL1 x
CPU-Bus1 x
Digital GPIO8 x
Ethernet 100BASE-TX1 x
I²C Interface1 x
MMC/SDC Interface2 x
SPI Interface1 x
UART IrDA0 x
UART LVTTL4 x
UART RS2321 x
USB Device 2.0 high speed1 x
USB Host 2.0 high speed1 x
Miscellaneous
RTC (battery buffered)1 x
Special Functions
CPU performance: up to 1 GHz - 2000 DMIPS
Co-Processor: ARM NEON, VFPU
Video processing (hardware accelerated): H.264 decode at 1080p30 and H.264 encode at 720p30
2D (Hardware accelerated): openVG 1.1
3D (Hardware accelerated): openGL ES 2.0 & 1.1 (33 Mtri/s, 200 Mpix/s, 800 Mpix/s z-plane), Direct3D Mobile 1.2


Operating Temperature
0°C to 70°C
-40°C to 85°C optional


Mechanical Dimensions
67,6mm x 50mm x 10mm (WxDxH)

If you need not listed features please contact emtrion!

More information regarding this product are available in our SupportNet.